Mil-Temp Micro-ACE® TE and Total-ACE® MIL-STD-1553 BGA’s Minimize Size, Weight, and Power (SWaP)!

Data Device Corporation (DDC) introduces Mil-Temp versions of its field-proven and highly efficient Micro-ACE® TE and Total-ACE® MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations. The Micro-ACE® TE terminals integrate 1553 protocol, memory, and transceivers in a small plastic BGA package that is lightweight and small-sized to save board space, weight, and power. The Total-ACE® further integrates 1553 transformers to offer a complete solution for one dual redundant MIL-STD-1553 channel.

Benefits include:

• Operating Temperature: -55ºC to +125ºC
• Minimize SWaP (Size, Weight, and Power)
  • Small Footprint Saves Board Space and Decreases Weight
  • Low Power Dissipation
• DO-254 Certifiable
  • Field Proven and Reliable Technology with over 200 Million Hours of In-Service History
• Supports MIL-STD-1553 A/B, MIL-STD-1760, STANAG 3838, and MacAir

“These efficient and highly reliable Micro-ACE® TE and Total-ACE® components are ideal for extended temperature range applications where board space is limited, and weight and power are at a premium”, stated Sean Sleicher, DDC’s Data Bus Marketing Manager.