ULIS releases ATT0640™, world’s smallest 60 Hz VGA/12 micron thermal image sensor

Atto640 enables use of smaller thermal cameras with extended battery autonomy in portable equipment for commercial and defense applications

ULIS will display Atto640 at SPIE Defense and Commercial Sensing, booth #640, Baltimore (MD), April 14 – 18, 2019

Grenoble, France April 9, 2019 - ULIS, a designer and manufacturer of a wide range of innovative thermal image sensors, today announces the launch of Atto640TM, a VGA/12 micron thermal image sensor for market applications where reducing the overall size and cost of the camera are key. These cover commercial and defense applications, such as Thermal Weapon Sights (TWS), surveillance and handheld thermography cameras, as well as Personal Vision Systems (PVS), including portable monoculars and binoculars for consumer outdoor leisure, law enforcement and border control.

The PVS segment is seen as significantly contributing to the growing global infrared market, expected to reach 30% annual unit growth between 2018-2024, according to the Yole Developpement report on ‘Uncooled Infrared Imagers and Detectors 2019 (p.17).

ULIS designed Atto640, the smallest 60 Hz VGA/12-micron detector (16.5 x 16.5 mm surface mount device), to address the SWaP (Size, Weight and Power) reduction requirements across the full range of commercial and defense thermal image applications and to respond to market growth.

ULIS is adding a VGA format to its existing QVGA Atto320 to give camera manufacturers more choice in its 12 µm product range. The interest for camera makers is that, compared to 17 µm pixel pitch technology, the 12 µm pitch enables them to use smaller and lower cost optics.

“ULIS is delighted to be introducing at SPIE DCS 2019 - the leading global sensing, imaging and photonics technologies event - the world’s smallest VGA/12-micron thermal image sensor for defense and commercial applications,” said Sébastien Tinnes, head of marketing at ULIS. “Manufacturers are calling for ever smaller components. We have delivered on that challenge, along with providing quality performance and volume production capabilities.”

Atto640 achieves its size advantage over competing models through its Wafer Level Packaging (WLP) technology, in which the detector window is directly bonded to the wafer, a technique enabling a significant reduction in the overall dimension of the sensor. Atto640’s footprint is half the size of ULIS’ Pico640-046 (17µm) model. Since Atto640 is designed with WLP, a batch-processing technique, it is suited to high-volume production.

Samples of Atto640 are currently available, with production ramp-up slated for the end of 2019. ULIS intends to further extend its 12µm product line up with larger resolution sensors.

ULIS will exhibit Atto640 at booth #640 during SPIE DCS 2019, Baltimore (MD), April 14 – 18, 2019.