Entropy Electro Mechanical Solutions

Entropy is a leader in providing thermal technologies and simulation solutions for rugged embedded environments. We continue to produce and develop leading products that will achieve, and help test, maximum operating performance for electronic systems in harsh environments.

With the current focus on interoperability, and the relentless increase of thermal power density in silicon devices, embedded systems and ruggedized chassis need a focus on driving SWAP-C optimisation more than ever. Our solutions, with new technology and excellent engineering, target the mechanical packaging opportunities this challenge provides and allows our customers to produce best in class products.

Using extensive experience working in MilAero packaging design, we also support: design of improved thermal solutions for all VITA-48.x and IEEE1101.x specifications, provide predictive life simulations to support VITA-51.x, and validate extended shock and vibration requirements in accordance with MIL-STD-810.

Entropy specialises exclusively in the Defence and Avionics space giving our customers improved design confidence and reduced time to delivery that other solutions providers can not. We focus primarily on the root cause of thermal loading, which is typically the silicon core architecture of the product and have optimised the methods extracting heat from these devices. In order to be highly effective, our approach uses detailed chip level modelling of devices such as:

•    Intel Core, Xeon and Atom processors
•    Xilinx Ultrascale+
•    Nvidia Jetson SoM, Quadro Turing, Pascal and GTX
•    AMD Ryzen and Epyc

All our solutions are carefully validated against representative testing data. We are confident that by using first class experience in this challenging industry, by rigorously employing engineering fundamental principles, and the application of leading simulation skills that your product will be as ready for the field as possible.